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MTPV Power Corporation Awarded National Science Foundation Grant to Advance Heat to Power Technology Innovation

Award Continues History of Research Funding by NSF in Clean Power Technology
 
AUSTIN, TX - BOSTON, MA MARCH 16, 2015 MTPV Power Corporation, a clean energy company that coverts heat to electricity using semiconductor chips, today announced it has been awarded a further Technology Enhancement for Commercial Partnerships (TECP) grant from the National Science Foundation (NSF).
MTPV has previously been awarded Small Business Innovation Research (SBIR) Phase I, Phase II, and TECP grants from the NSF. The TECP program supplements the work of SBIR grantees and is intended to pave the way for MTPV partnerships with strategic corporate partners and investors to increase the potential to successfully commercialize their technology.
Partnerships are recognized as a critical success factor for commercializing complex technologies. As potential partners typically require technical specifications and proof-of-concept data as a prerequisite for partnership, this supplemental funding will enable MTPV to conduct additional research to meet the requirements of corporate partners.

“We are delighted with the NSF's continued support of our journey to commercialization.” said David Mather, President and CEO of MTPV. “Being selected for a TECP grant is further validation of the maturity of our technology and the outstanding work of the MTPV R&D team."

About MTPV Power Corporation
MTPV creates semiconductor chips that covert heat directly into electricity. Much like a solar panel will convert sunlight into electricity, MTPV chips are able to convert any source of heat into electricity with breakthrough efficiency and power.


For more information, visit: http://www.mtpv.com

MEDIA CONTACT:
Colin Lacey
Email: communication(at)mtpv(dot)com

 

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